End effector assembly for clean/dirty substrate handling

ABSTRACT

An end effector includes first, second, third, fourth, fifth, sixth, and seventh substrate support pads. A method of handling a substrate with the end effector in a substrate processing system includes engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads. The method also includes moving the end effector a first distance into a processing chamber of the substrate processing system. The method further includes disengaging the peripheral edge of the substrate from the second, fifth, and sixth substrate support pads. The method additionally includes moving the end effector a second distance into the processing chamber of the substrate processing system, and engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads.

FIELD

The present disclosure relates to substrate handling systems, and moreparticularly to a device and method for handling substrates in asubstrate processing system.

BACKGROUND

The background description provided here is for the purpose of generallypresenting the context of the disclosure. Work of the presently namedinventors, to the extent it is described in this background section, aswell as aspects of the description that may not otherwise qualify asprior art at the time of filing, are neither expressly nor impliedlyadmitted as prior art against the present disclosure.

Substrate processing systems may be used to perform etching and/or otherprocessing of substrates such as semiconductor wafers. When processingsubstrates, a robot with an end effector may be used to place anunprocessed or clean substrate on a pedestal in a processing chamber ofthe substrate processing system. During processing, a gas mixture isintroduced into the processing chamber and plasma may be struck todeposit, etch and/or otherwise treat the substrate. After the substratehas been treated, the end effector may be used to remove the treated ordirty substrate from the processing chamber.

SUMMARY

In one aspect, the present disclosure provides a method of handling asubstrate with an end effector in a substrate processing system. The endeffector includes first, second, third, fourth, fifth, sixth, andseventh substrate support pads. The method includes engaging aperipheral edge of the substrate with the second, fifth, and sixthsubstrate support pads. The method also includes moving the end effectora first distance into a processing chamber of the substrate processingsystem. The method further includes disengaging the peripheral edge ofthe substrate from the second, fifth, and sixth substrate support pads.The method additionally includes moving the end effector a seconddistance into the processing chamber of the substrate processing system,and engaging the peripheral edge of the substrate with the first, third,fourth, and seventh substrate support pads.

In some configurations, the first and third substrate support padsdefine a first height, and the fourth and sixth substrate support padsdefine a second height that is less than the first height.

In some configurations, the second substrate support pad defines a firstheight, and the fifth and sixth substrate support pads define a secondheight that is greater than the first height.

In some configurations, the first and third substrate support padsdefine a third height that is equal to the second height, and the fourthand sixth substrate support pads define a fourth height that is equal tothe first height.

In some configurations, engaging a peripheral edge of the substrate withthe second, fifth, and sixth substrate support pads includes positioningthe fourth and seventh substrate support pads radially inward of theperipheral edge of the substrate.

In some configurations, engaging the peripheral edge of the substratewith the first, third, fourth, and seventh substrate support padsfurther includes positioning the second substrate support pad radiallyinward of the peripheral edge of the substrate.

In some configurations, the second, fifth, and sixth substrate supportpads define a first circle having a first diameter and a first centralaxis.

In some configurations, the first, third, fourth, and seventh substratesupport pads define a second circle having a second diameter and asecond central axis, and the substrate defines a third circle having athird central axis.

In some configurations, engaging the peripheral edge of the substratewith the second, fifth, and sixth substrate support pads includesdisposing the second central axis at a first angle relative to a thirdcentral axis.

In some configurations, engaging the peripheral edge of the substratewith the first, third, fourth, and seventh substrate support padsincludes disposing the first central axis at a second angle relative tothe third central axis.

In some configurations, the first angle is equal to the second angle.

In some configurations, the first diameter is equal to the seconddiameter.

In some configurations, the first, second, third, fourth, fifth, sixth,and seventh substrate support pads include first, second, third, fourth,fifth, sixth, and seventh inclined substrate support surfaces,respectively.

In another aspect, the present disclosure provides an end effector. Theend effector includes a body, a first tine, and a second tine. The bodyincludes first, second, and third substrate support pads. The firstsubstrate support pad defines a first height. The second substratesupport pad defines a second height that is less than the first height.The third substrate support pad defines a third height that is equal tothe first height. The first tine extends from the body and includesfourth and fifth substrate support pads. The fourth substrate supportpad defines a fourth height that is equal to the second height. Thefifth substrate support pad defines a fifth height that is equal to thefirst and third heights. The second tine extends from the body andincludes sixth and seventh substrate support pads. The sixth substratesupport pad defines a sixth height that is equal to the first, third,and fifth heights. The seventh substrate support pad defines a seventhheight that is equal to the second and fourth heights.

In some configurations, the first, third, fourth, and seventh substratesupport pads define a first circle having a first diameter and a firstcentral axis, and the second, fifth, and sixth substrate support padsdefine a second circle having a second diameter and a second centralaxis.

In some configurations, the first diameter is equal to the seconddiameter.

In some configurations, the first central axis is linearly offset fromthe second central axis.

In some configurations, the first and second central axes define anangle.

In some configurations, the body portion is monolithically formed withthe first and second tine portions.

In yet another aspect, the present disclosure provides an end effector.The end effector includes first, second, third, fourth, fifth, sixth,and seventh substrate support pads. The first, third, fourth, andseventh substrate support pads define a first circle. The second, fifth,and sixth substrate support pads define a second circle. The firstcircle includes a first diameter and a first central axis. The secondcircle includes a second diameter equal to the first diameter and asecond central axis offset from the first central axis. The firstsubstrate support pad defines a first height. The second substratesupport pad defines a second height that is less than the first height.The third substrate support pad defines a third height that is greaterthan the second height. The fourth substrate support pad defines afourth height that is less than the third height. The fifth substratesupport pad defines a fifth height that is greater than the fourthheight. The sixth substrate support pad defines a sixth height that isgreater than the fourth height. The seventh substrate support paddefines a seventh height that is less than the sixth height.

In some configurations, the first and second central axes define anangle.

In some configurations, the end effector includes a body portion andfirst and second tine portions extending from the body portion. Each ofthe fourth, fifth, sixth, and seventh substrate support pads may bedisposed on one of the first and second tine portions.

In some configurations, the body portion is monolithically formed withthe first and second tine portions.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description, the claims and the drawings. Thedetailed description and specific examples are intended for purposes ofillustration only and are not intended to limit the scope of thedisclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thedetailed description and the accompanying drawings, wherein:

FIG. 1 is a functional block diagram of an example of a substrateprocessing system according to the principles of the present disclosure;

FIG. 2 is a functional block diagram of an example of substrateprocessing tool according to the principles of the present disclosure;

FIG. 3 is a perspective view of an example of an end effector accordingto the principles of the present disclosure;

FIG. 4A is a first lateral side view of the end effector of FIG. 3according to the principles of the present disclosure;

FIG. 4B is a second lateral side view of the end effector of FIG. 3according to the principles of the present disclosure;

FIG. 5 is a top side view of the end effector of FIG. 3 according to theprinciples of the present disclosure;

FIG. 6A is an environmental view of a load lock and the end effector ofFIG. 3 according to the principles of the present disclosure; and

FIG. 6B is another environmental view of the load lock and the endeffector of FIG. 3 according to the principles of the presentdisclosure.

In the drawings, reference numbers may be reused to identify similarand/or identical elements.

DETAILED DESCRIPTION

A substrate, such as a semiconductor wafer, is positioned on a pedestalof a load lock to be transferred into and out of a processing chamber bya substrate handling system. For example, a robot including an endeffector may be used to transport the substrate (e.g., an unprocessed orclean substrate having a first temperature) from the load lock to theprocessing chamber. After the substrate is processed in the processingchamber, the end effector removes and transports the substrate (e.g., aprocessed or dirty substrate having a second temperature different thanthe first temperature) from the processing chamber for subsequent use orprocessing. For example, the end effector may transport the substratefrom the processing chamber to the load lock or to another processingchamber.

Heat, particles, and other forms of contamination can have an adverseeffect on substrate processing. For example, temperature variations(e.g., localized hotspots) within the substrate can lead to non-uniformprocessing results, such as non-uniformity of critical deviceparameters. Temperature variations within the substrate can alsoadversely affect mass measurements taken of the substrate duringprocessing. In yet another example, transferring particles and othercontaminants to the unprocessed substrates can lead to defects in theprocessed substrates. Accordingly, it is desirable to prevent processedsubstrates from contaminating unprocessed substrates. In particular, itis often desirable to prevent the transfer of heat, particles, and/orother forms of contamination from the processed substrate to theunprocessed substrate.

Substrate handling systems and methods according to the principles ofthe present disclosure include a robot with an end effector having aconfiguration of substrate support pads to engage or support thesubstrate in at least two discrete positions relative to the endeffector. In particular, the substrate handling system includes a firstor clean set of stationary substrate support pads and a second or dirtyset of stationary substrate supports pads. When the substrate issupported in a first position relative to the end effector, the firstset of substrate support pads engage the substrate, and the second setof substrate support pads are disengaged from the substrate. When thesubstrate is supported in a second position relative to the endeffector, the second set of substrate support pads engage the substrate,and the first set of substrate support pads are disengaged from thesubstrate.

In some configurations, the first set of substrate support pads willonly engage the unprocessed substrate, and the second set of substratesupport pads will only engage the processed substrate. In otherconfigurations, the second set of substrate support pads will onlyengage the unprocessed substrate, and the first set of substrate supportpads will only engage the processed substrate. Engaging only one of thefirst and second sets of substrate support pads with the unprocessedsubstrate, and engaging only the other of the first and second sets ofsubstrate support pads with the processed substrate, prevents theprocessed substrate from contaminating the unprocessed substrate througheither of the first and second sets of substrate support pads. Inparticular, heat, particles, and other forms of contamination that maybe transferred from the processed substrate to the substrate supportpads are prevented from being subsequently transferred from thesubstrate support pads to the unprocessed substrate.

Referring now to FIG. 1, an example of a substrate processing system 100for performing etching using RF plasma is shown. The substrateprocessing system 100 includes a processing chamber 102 that enclosesother components of the substrate processing chamber 102 and containsthe RF plasma. The substrate processing chamber 102 includes an upperelectrode 104 and a pedestal 106 including a lower electrode 107. Anedge coupling ring 103 is supported by the pedestal 106. One or moreactuators 105 may be used to move the edge coupling ring 103. Duringoperation, a substrate 108 is arranged on the pedestal 106 between theupper electrode 104 and the lower electrode 107 and the edge couplingring 103 is arranged around the substrate 108.

For example only, the upper electrode 104 may include a showerhead 109that introduces and distributes process gases. The showerhead 109 mayinclude a stem portion including one end connected to a top surface ofthe processing chamber 102. A base portion is generally cylindrical andextends radially outwardly from an opposite end of the stem portion at alocation that is spaced from the top surface of the processing chamber102. A substrate-facing surface or faceplate of the base portion of theshowerhead includes a plurality of holes through which process gas orpurge gas flows. Alternately, the upper electrode 104 may include aconducting plate and the process gases may be introduced in anothermanner. The lower electrode 107 may be arranged in a non-conductivepedestal. Alternately, the pedestal 106 may include an electrostaticchuck that includes a conductive plate that acts as the lower electrode107.

An RF generating system 110 generates and outputs an RF voltage to oneof the upper electrode 104 and the lower electrode 107. The other one ofthe upper electrode 104 and the lower electrode 107 may be DC grounded,AC grounded or floating. For example only, the RF generating system 110may include an RF voltage generator 111 that generates the RF voltagethat is fed by a matching and distribution network 112 to the upperelectrode 104 or the lower electrode 107. In other examples, the plasmamay be generated inductively or remotely.

A gas delivery system 130 includes one or more gas sources 132-1, 132-2,. . . , and 132-N (collectively gas sources 132), where N is an integergreater than zero. The gas sources 132 supply one or more gas mixtures.The gas sources 132 may also supply purge gas. Vaporized precursor mayalso be used. The gas sources 132 are connected by valves 134-1, 134-2,. . . , and 134-N (collectively valves 134) and mass flow controllers136-1, 136-2, . . . , and 136-N (collectively mass flow controllers 136)to a manifold 140. An output of the manifold 140 is fed to theprocessing chamber 102. For example only, the output of the manifold 140is fed to the showerhead 109.

A heater 142 may be connected to a heater coil (not shown) arranged inthe pedestal 106. The heater 142 may be used to control a temperature ofthe pedestal 106 and the substrate 108. A valve 150 and pump 152 may beused to evacuate reactants from the processing chamber 102. A controller160 may be used to control components of the substrate processing system100. The controller 160 may also be used to control the actuator 105 toadjust a position of one or more portions of the edge coupling ring 103.

A robot 170 including an end effector may be used to deliver substratesonto, and remove substrates from, the pedestal 106. For example, therobot 170 may transfer substrates between the pedestal 106 and a loadlock 172 according to the principles of the present disclosure.

Referring now to FIG. 2, a non-limiting example substrate processingtool 200 (e.g., as implemented within the substrate processing system100) includes a transport handling chamber 220 and multiple reactorseach with one or more substrate processing chambers. A substrate 225enters the substrate processing tool 200 from a cassette and/or pod 223,such as a front opening unified pod (FOUP). A robot 224, including oneor more end effectors 226, handles the substrate 225. A pressure of thetransport handling chamber 220 may be at atmospheric pressure.Alternately, the transport handling chamber 220 may be at vacuumpressure (with ports acting as isolation valves).

The robot 224 moves the substrate 225 from the pod 223 to a load lock230. For example, the substrate 225 enters the load lock 230 through aport 232 (or isolation valve) and is placed on a load lock pedestal 233.The port 232 to the transport handling chamber 220 closes and the loadlock 230 is pumped down to an appropriate pressure for transfer. It willbe appreciated that upon entering the load lock 230, the substrate 225may be in an unprocessed state. For example, upon entering the load lock230, the substrate 225 may be referred to as an unprocessed or cleansubstrate and may have a first temperature T1.

The robot 224 transfers the unprocessed substrate 225 from the pod 223and to the load lock 230 under the guidance of a controller (e.g., thecontroller 160 as shown in FIG. 1) according to the principles of thepresent disclosure. For example, the controller 160 can guide the robot224 and the end effector 226 to remove the substrate 225 from the pod223 and to place the substrate 225 into the load lock 230. Inparticular, the controller 160 may guide the robot 224 and/or the endeffector 226 into a first position relative to the load lock pedestal233.

A robot 236, including one or more end effectors 238, in a processinghandling chamber 235 moves the substrate from the load lock 230 to aselected reactor 240-1, 240-2, and 240-3 (collectively reactors 240).For example, a port 234 opens and the robot 236 may place the substratesthrough one of the ports 237-1, 237-2, 237-3 (collectively ports 237)corresponding to the selected reactor 240-1, 240-2, and 240-3. Althoughthe load lock 230 is shown having multiple pedestals 233 and associatedports 232, 234, in some embodiments the load lock 230 may include only asingle pedestal 233 and respective ports 232, 234.

The robot 236 transfers the substrates from the load lock 230, and toand from the processing chamber of the reactor 240, under the guidanceof the controller (e.g., the controller 160 as shown in FIG. 1)according to the principles of the present disclosure. For example, thecontroller 160 can guide the robot 236 and the end effector 238 toremove the substrate 225 from the load lock 230 and to place thesubstrate 225 into the processing chamber of the reactor 240 forprocessing. In particular, the controller 160 may guide the robot 236and/or the end effector 238 into a first position relative to thetransfer plate 246 of the reactor 240. Prior to entering the processingchamber of the reactor 240, the substrate 225 may be in the unprocessedstate. For example, the substrate 225 may have the first temperature T1.

A substrate indexing mechanism 242 may be used to further position thesubstrates relative to the substrate processing chambers of the reactors240. In some examples, the indexing mechanism 242 includes a spindle 244and transfer plates 246.

In some examples, at least one of the processing chambers or stations ofthe reactors 240 is capable of performing semiconductor processingoperations, such as a material deposition or etch, sequentially orsimultaneously with the other stations. In some examples, one or more ofthe stations may perform RF-based semiconductor processing operations.

The substrate is moved from one station to the next in the reactor 240using the substrate indexing mechanism 242. One or more of the stationsof the reactors 240 may be capable of performing RF plasma deposition oretching. During use, the substrates are moved to one or more of thereactors 240, processed and then returned. As can be appreciated,reducing the handling time of each substrate improves productivity andthroughput.

After the substrate 225 has been processed in the processing chamber ofthe reactor 240, the controller 160 can guide the robot 236 and the endeffector 238 to remove the substrate 225 from the processing chamber ofthe reactor 240. In particular, the controller 160 may guide the robot236 and/or the end effector 238 into a second position, different thanthe first position, relative to the transfer plate 246 of the reactor240. It will be appreciated that upon removal from the processingchamber of the reactor 240, the substrate 225 may be in a processedstate. For example, upon removal from the processing chamber of thereactor 240, the substrate 225 may be referred to as a processed ordirty substrate and may have a second temperature T2 that is differentthan the first temperature T1. In particular, the second temperature T2of the substrate 225 in the processed state may be greater than thefirst temperature T1 of the substrate 225 in the unprocessed state.

The controller 160 can guide the robot 236 and the end effector 238 toplace the processed substrate 225 into the load lock 230. For example,the processed substrate 225 enters the load lock 230 through the port234 and is placed on the load lock pedestal 233. The robot 236 transfersthe substrate to the load lock 230 under the guidance of the controlleraccording to the principles of the present disclosure.

The robot 224, including the end effector 226, moves the processedsubstrate 225 from the load lock 230 to the pod 223 through one of theports 232. For example, the controller 160 can guide the robot 224 andthe end effector 226 to remove the substrate 225 from the load lock 230and to place the substrate 225 into the pod 223. In particular, thecontroller 160 may guide the robot 224 and/or the end effector 226 intoa second position relative to the load lock pedestal 233.

Referring now to FIGS. 3-5, an example robot (e.g., the robot 224 and/orthe robot 236 shown in FIG. 2) having an end effector 300 according tothe principles of the present disclosure is shown. As illustrated, insome configurations, the robot includes more than one end effector 300.In particular, the robot may include a plurality of stacked endeffectors 300. The end effector 300 includes a body portion 302 andfirst and second tine portions 304, 306. The first and second tineportions 304, 306 extend from body portion 302 such that the endeffector 300 defines a generally forked shape or configuration having asubstrate-facing surface 308. As illustrated, in some configurations thebody portion 302 is integrally or monolithically formed with the firstand/or second tine portions 304, 306. It will be appreciated, however,that the body portion 302 and the first and/or second tine portions 304,306 may be separate and distinct members within the scope of the presentdisclosure.

The end effector 300 further includes first, second, third, fourth,fifth, sixth, and seventh substrate support pads 312, 314, 316, 318,320, 322, 324. In some configurations the first, second, and thirdsubstrate support pads 312, 314, 316 are disposed on the body portion302, the fourth and fifth substrate support pads 318, 320 are disposedon the first tine portion 304, and the sixth and seventh substratesupport pads 322, 324 are disposed on the second tine portion 306. Inthis regard, the first, second, third, fourth, fifth, sixth, and seventhsubstrate support pads 312, 314, 316, 318, 320, 322, 324 may bestationary relative to the body portion 302 and the first and secondtine portions 304, 306 of the end effector 300.

As illustrated in FIGS. 4A and 4B, the first, second, third, fourth,fifth, sixth, and/or seventh substrate support pads 312, 314, 316, 318,320, 322, 324 may be inclined relative to one another and/or relative tothe substrate-facing surface 308 of the end effector 300. In particular,the first, second, third, fourth, fifth, sixth, and/or seventh substratesupport pads 312, 314, 316, 318, 320, 322, 324 may include first,second, third, fourth, fifth, sixth, and/or seventh inclined surfaces312 a, 314 a, 316 a, 318 a, 320 a, 322 a, 324 a, respectively, that areinclined toward the substrate-facing surface 308 of the end effector 300in a radially inward direction.

The first, second, third, fourth, fifth, sixth, and seventh substratesupport pads 312, 314, 316, 318, 320, 322, 324 define first, second,third, fourth, fifth, sixth, and seventh heights h1, h2, h3, h4, h5, h6,h7, respectively, relative to the substrate-facing surface 308 of theend effector 300. In particular, the inclined surfaces 312 a, 314 a, 316a, 318 a, 320 a, 322 a, 324 a may define the first, second, third,fourth, fifth, sixth, and seventh heights h1, h2, h3, h4, h5, h6, h7. Aswill be explained in more detail below, the first, second, third,fourth, fifth, sixth, and seventh heights h1, h2, h3, h4, h5, h6, h7 maydefine a location at which the first, second, third, fourth, fifth,sixth, and seventh substrate support pads 312, 314, 316, 318, 320, 322,324 engage or otherwise support a substrate 334 (FIGS. 6A and 6B), suchas a semiconductor wafer.

The first and third heights h1, h3 are greater than the second heighth2. In this regard, the first and third heights h1, h3 may be equal toone another. The fifth height h5 is greater than the fourth height h4,and the sixth height h6 is greater than the seventh height h7. In thisregard, the fifth height h5 may be equal to the sixth height h6, and thefourth height h4 may be equal to the seventh height h7. In someconfigurations, the first, third, fifth, and sixth heights h1, h3, h5,h6 are equal to one another, and the second, fourth, and seventh heightsh2, h4, h7 are equal to one another. In particular, the first, third,fifth, and sixth heights h1, h3, h5, h6 may be between 1.1 and 2.1millimeters greater than the second, fourth, and seventh heights h2, h4,h7. In some configurations, the first, third, fifth, and sixth heightsh1, h3, h5, h6 are 1.5 millimeters greater than the second, fourth, andseventh heights h2, h4, h7.

With reference to FIG. 5, the first, third, fourth, and seventhsubstrate support pads 312, 316, 318, 324 define a first circle 328having a first diameter D1 and a first central axis A1. The second,fifth, and sixth substrate support pads 314, 320, 322 define a secondcircle 330 having a second diameter D2 and a second central axis A2.Accordingly, as illustrated in FIG. 5, the third substrate support pad316 is located between the first and fourth substrate support pads 312,318 relative to the first circle 328, the fourth substrate support pad318 is located between the third and seventh substrate support pads 316,324 relative to the first circle 328, and the seventh substrate supportpad 324 is located between the first and fourth substrate support pads312, 318 relative to the first circle 328. Similarly, the secondsubstrate support pad 314 is located between the fifth and sixthsubstrate support pads 320, 322 relative to the second circle 330, andthe fifth substrate support pad 320 is located between the second andsixth substrate support pads 314, 322 relative to the second circle 330.

The first diameter D1 is equal to the second diameter D2, and the firstaxis A1 is offset relative to the second axis A2. In particular, thefirst axis A1 is linearly offset relative to the second axis A2 by adistance X1 (FIG. 5), and the first axis A1 is angularly offset orrotated by an angle a relative to the second axis A2 (FIG. 4A). Thedistance X1 may be between 5 millimeters and 15 millimeters. In someconfigurations, the distance X1 is equal to 10 millimeters.

The first and second diameters D1, D2 may further equal a third diameterD3 of the substrate 334 (FIGS. 6A and 6B). Accordingly, as will beexplained in more detail below, when the substrate 334 is in a firstposition, the first, third, fourth, and seventh substrate support pads312, 316, 318, 324 may engage a peripheral edge 336 of the substrate334, and when the substrate is in a second position, the second, fifth,and sixth substrate support pads 314, 320, 322 may engage the peripheraledge 336 of the substrate 334.

Referring now to FIGS. 6A-6B, an example method of handling thesubstrate 334 with the end effector 300 in a substrate processing system340 will be described according to the principles of the presentdisclosure. The method is implemented using various components of FIGS.1-6B, as described below.

With reference to FIG. 6A, a first mode of operation will be describedrelative to moving the substrate 334 in an unprocessed state. Inparticular, the first mode of operation will be described relative tomoving the substrate 334 from a load lock (e.g., the load lock 230 ofFIG. 2) to a processing chamber 342 of a reactor 344 with a robot (e.g.,the robot 236 of FIG. 2) having the end effector 300. It will beappreciated, however, that the first mode of operation may also includemoving the substrate 334 from a pod (e.g., the pod 223 of FIG. 2) to theload lock with a robot (e.g., the robot 224 of FIG. 2) having the endeffector 300.

In the first mode of operation, the second, fifth, and sixth substratesupport pads 314, 320, 322, at the second, fifth, and sixth heights h2,h5, h6, respectively, may engage the peripheral edge 336 of thesubstrate 334 to remove the substrate 334 from the load lock and movethe substrate 334 into the processing chamber 342. Accordingly, when thesecond, fifth, and sixth substrate support pads 314, 320, 322 engage theperipheral edge 336 of the substrate 334, the fourth and seventhsubstrate support pads 318, 324 are disposed directly between thesubstrate 334 and the substrate-facing surface 308 of the end effector300. In particular, the fourth and seventh substrate support pads 318,324 are disposed radially inward of the peripheral edge 336, and thefirst and third substrate support pads 312, 316 are disposed radiallyoutward of the peripheral edge 336. In addition, a central axis A3 ofthe substrate 334 is aligned with the second axis A2 of the secondcircle 330 as the substrate 334 is moved into processing chamber 342. Itwill be appreciated that the substrate 334 may be clean or otherwise inan unprocessed condition prior to entering the processing chamber 342,and while being engaged by the second, fifth, and sixth substratesupport pads 314, 320, 322.

In order to place the substrate 334 in the processing chamber 342, acontroller (e.g., the controller 160 as shown in FIG. 1) may guide arobot (e.g., the robot 236 as shown in FIG. 2) and/or the end effector300 into a first position relative to a transfer plate 346 of theprocessing chamber 342. In particular, the controller may guide the endeffector 300 a first distance into the first position within theprocessing chamber 342. The substrate 334 may be transferred to thetransfer plate 346 using the robot under control of the controller. Thesubstrate 334 is then processed in accordance with the methods andprocedures previously described herein.

With reference to FIG. 6B, a second mode of operation will be describedrelative to moving the substrate 334 in a processed state. Inparticular, the second mode of operation will be described relative tomoving the substrate 334 from the processing chamber 342 of the reactor344 to the load lock with a robot (e.g., the robot 236 of FIG. 2) havingthe end effector 300. It will be appreciated, however, that the secondmode of operation may also include moving the substrate 334 from theload lock to the pod with a robot (e.g., the robot 224 of FIG. 2) havingthe end effector 300.

As illustrated in FIG. 6B, subsequent to processing, the end effector300 removes the substrate 334 from the processing chamber 342 of thereactor 344 in the second mode of operation. Specifically, the first,third, fourth, and seventh substrate support pads 312, 316, 318, 324, asthe first, third, fourth, and seventh heights h1, h3, h4, h7,respectively, may engage the peripheral edge 336 of the substrate 334 toremove the substrate 334 from the processing chamber. Accordingly, whenthe first, third, fourth, and seventh substrate support pads 312, 316,318, 324 engage the peripheral edge 336 of the substrate 334, the secondsubstrate support pad 314 is disposed directly between the substrate 334and the substrate-facing surface 308 of the end effector 300. Inparticular, the second substrate support pad 314 is disposed radiallyinward of the peripheral edge 336, and the fifth and sixth substratesupport pads 320, 322 are disposed radially outward of the peripheraledge 336. In addition the central axis A3 of the substrate 334 may bealigned with the first axis A1 of the first circle 328 when thesubstrate 334 is removed from processing chamber 342. It will beappreciated that the substrate 334 may be dirty or otherwise in aprocessed condition upon being removed from the processing chamber 342,and while being engaged by the first, third, fourth, and seventhsubstrate support pads 312, 316, 318, 324.

In order to remove the substrate 334 from the processing chamber 342,the controller may guide the robot and/or the end effector 300 into asecond position relative to the transfer plate 346 of the processingchamber 342. In particular, the controller may guide the end effector300 a second distance into the second position within the processingchamber 342. A distance X2 between the first position of the first modeof operation and the second position of the second mode of operation issubstantially equal to the distance X1 between the first and second axesA1, A2 (FIG. 5) of the first and second circles 328, 330. The substrate334 may then be transferred to the end effector 300 using the robotunder control of the controller.

As described above, the example method of handling the substrate 334with the end effector 300 may include guiding the end effector 300 firstand second distances into the first and second positions within theprocessing chamber 342 during the first and second modes of operation,respectively. It will be appreciated, however, that the method can alsoinclude moving the end effector 300 a first distance in each of thefirst and second modes of operation, and moving the substrate 334 thedistance X2 during one of the first and second modes of operation. Forexample, after moving the substrate 334 into the processing chamber 340,and prior to removing the substrate from the processing chamber 342, themethod may include moving the substrate 334 by the distance X2.

The foregoing description is merely illustrative in nature and is in noway intended to limit the disclosure, its application, or uses. Thebroad teachings of the disclosure can be implemented in a variety offorms. Therefore, while this disclosure includes particular examples,the true scope of the disclosure should not be so limited since othermodifications will become apparent upon a study of the drawings, thespecification, and the following claims. As used herein, the phrase atleast one of A, B, and C should be construed to mean a logical (A OR BOR C), using a non-exclusive logical OR, and should not be construed tomean “at least one of A, at least one of B, and at least one of C.” Itshould be understood that one or more steps within a method may beexecuted in different order (or concurrently) without altering theprinciples of the present disclosure.

Example embodiments are provided so that this disclosure will bethorough, and will fully convey the scope to those who are skilled inthe art. Numerous specific details are set forth such as examples ofspecific components, devices, and methods, to provide a thoroughunderstanding of embodiments of the present disclosure. It will beapparent to those skilled in the art that specific details need not beemployed, that example embodiments may be embodied in many differentforms and that neither should be construed to limit the scope of thedisclosure. In some example embodiments, well-known processes,well-known device structures, and well-known technologies are notdescribed in detail.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting. As usedherein, the singular forms “a,” “an,” and “the” may be intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. The terms “comprises,” “comprising,” “including,” and“having,” are inclusive and therefore specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. The method steps, processes, and operations described hereinare not to be construed as necessarily requiring their performance inthe particular order discussed or illustrated, unless specificallyidentified as an order of performance. It is also to be understood thatadditional or alternative steps may be employed.

Although the terms first, second, third, etc. may be used herein todescribe various elements, components, regions, layers and/or sections,these elements, components, regions, layers and/or sections should notbe limited by these terms. These terms may be only used to distinguishone element, component, region, layer or section from another region,layer or section. Terms such as “first,” “second,” and other numericalterms when used herein do not imply a sequence or order unless clearlyindicated by the context. Thus, a first element, component, region,layer or section discussed below could be termed a second element,component, region, layer or section without departing from the teachingsof the example embodiments.

Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,”“lower,” “above,” “upper,” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. Spatiallyrelative terms may be intended to encompass different orientations ofthe device in use or operation in addition to the orientation depictedin the figures. For example, if the device in the figures is turnedover, elements described as “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the example term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

In some implementations, a controller is part of a system, which may bepart of the above-described examples. Such systems can comprisesemiconductor processing equipment, including a processing tool ortools, chamber or chambers, a platform or platforms for processing,and/or specific processing components (a substrate pedestal, a gas flowsystem, etc.). These systems may be integrated with electronics forcontrolling their operation before, during, and after processing of asemiconductor wafer or substrate. The electronics may be referred to asthe “controller,” which may control various components or subparts ofthe system or systems. The controller, depending on the processingrequirements and/or the type of system, may be programmed to control anyof the processes disclosed herein, including the delivery of processinggases, temperature settings (e.g., heating and/or cooling), pressuresettings, vacuum settings, power settings, radio frequency (RF)generator settings, RF matching circuit settings, frequency settings,flow rate settings, fluid delivery settings, positional and operationsettings, wafer transfers into and out of a tool and other transfertools and/or load locks connected to or interfaced with a specificsystem.

Broadly speaking, the controller may be defined as electronics havingvarious integrated circuits, logic, memory, and/or software that receiveinstructions, issue instructions, control operation, enable cleaningoperations, enable endpoint measurements, and the like. The integratedcircuits may include chips in the form of firmware that store programinstructions, digital signal processors (DSPs), chips defined asapplication specific integrated circuits (ASICs), and/or one or moremicroprocessors, or microcontrollers that execute program instructions(e.g., software). Program instructions may be instructions communicatedto the controller in the form of various individual settings (or programfiles), defining operational parameters for carrying out a particularprocess on or for a semiconductor wafer or to a system. The operationalparameters may, in some embodiments, be part of a recipe defined byprocess engineers to accomplish one or more processing steps during thefabrication of one or more layers, materials, metals, oxides, silicon,silicon dioxide, surfaces, circuits, and/or dies of a wafer.

The controller, in some implementations, may be a part of or coupled toa computer that is integrated with the system, coupled to the system,otherwise networked to the system, or a combination thereof. Forexample, the controller may be in the “cloud” or all or a part of a fabhost computer system, which can allow for remote access of the waferprocessing. The computer may enable remote access to the system tomonitor current progress of fabrication operations, examine a history ofpast fabrication operations, examine trends or performance metrics froma plurality of fabrication operations, to change parameters of currentprocessing, to set processing steps to follow a current processing, orto start a new process. In some examples, a remote computer (e.g. aserver) can provide process recipes to a system over a network, whichmay include a local network or the Internet. The remote computer mayinclude a user interface that enables entry or programming of parametersand/or settings, which are then communicated to the system from theremote computer. In some examples, the controller receives instructionsin the form of data, which specify parameters for each of the processingsteps to be performed during one or more operations. It should beunderstood that the parameters may be specific to the type of process tobe performed and the type of tool that the controller is configured tointerface with or control. Thus as described above, the controller maybe distributed, such as by comprising one or more discrete controllersthat are networked together and working towards a common purpose, suchas the processes and controls described herein. An example of adistributed controller for such purposes would be one or more integratedcircuits on a chamber in communication with one or more integratedcircuits located remotely (such as at the platform level or as part of aremote computer) that combine to control a process on the chamber.

Without limitation, example systems may include a plasma etch chamber ormodule, a deposition chamber or module, a spin-rinse chamber or module,a metal plating chamber or module, a clean chamber or module, a beveledge etch chamber or module, a physical vapor deposition (PVD) chamberor module, a chemical vapor deposition (CVD) chamber or module, anatomic layer deposition (ALD) chamber or module, an atomic layer etch(ALE) chamber or module, an ion implantation chamber or module, a trackchamber or module, and any other semiconductor processing systems thatmay be associated or used in the fabrication and/or manufacturing ofsemiconductor wafers.

As noted above, depending on the process step or steps to be performedby the tool, the controller might communicate with one or more of othertool circuits or modules, other tool components, cluster tools, othertool interfaces, adjacent tools, neighboring tools, tools locatedthroughout a factory, a main computer, another controller, or tools usedin material transport that bring containers of wafers to and from toollocations and/or load ports in a semiconductor manufacturing factory.

What is claimed is:
 1. A method of handling a substrate with an end effector in a substrate processing system, the end effector having first, second, third, fourth, fifth, sixth, and seventh substrate support pads, the method comprising: engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads; moving the end effector a first distance into a processing chamber of the substrate processing system; disengaging the peripheral edge of the substrate from the second, fifth, and sixth substrate support pads; moving the end effector a second distance into the processing chamber of the substrate processing system; and engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads.
 2. The method of claim 1, wherein the first and third substrate support pads define a first height, and the fourth and sixth substrate support pads define a second height that is less than the first height.
 3. The method of claim 1, wherein the second substrate support pad defines a first height, and the fifth and sixth substrate support pads define a second height that is greater than the first height.
 4. The method of claim 3, wherein the first and third substrate support pads define a third height that is equal to the second height, and the fourth and seventh substrate support pads define a fourth height that is equal to the first height.
 5. The method of claim 1, wherein engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads includes positioning the fourth and seventh substrate support pads radially inward of the peripheral edge of the substrate.
 6. The method of claim 5, wherein engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads further includes positioning the first and third substrate support pads radially outward of the peripheral edge of the substrate.
 7. The method of claim 1, wherein engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads further includes positioning the second substrate support pad radially inward of the peripheral edge of the substrate.
 8. The method of claim 7, wherein engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads further includes positioning the fifth and sixth substrate support pads radially outward of the peripheral edge of the substrate.
 9. The method of claim 1, wherein the second, fifth, and sixth substrate support pads define a first circle having a first diameter and a first central axis, the first, third, fourth, and seventh substrate support pads define a second circle having a second diameter and a second central axis, and the substrate defines a third circle having a third central axis, and wherein: engaging the peripheral edge of the substrate with the second, fifth, and sixth substrate support pads includes disposing the second central axis at a first angle relative to the third central axis; and engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads includes disposing the first central axis at a second angle relative to the third central axis.
 10. The method of claim 9, wherein the first angle is equal to the second angle.
 11. The method of claim 9, wherein the first diameter is equal to the second diameter.
 12. The method of claim 1, wherein the first, second, third, fourth, fifth, sixth, and seventh substrate support pads include first, second, third, fourth, fifth, sixth, and seventh inclined substrate support surfaces, respectively.
 13. The method of claim 1, wherein the first and third substrate support pads define a first height, and the fourth and seventh substrate support pads define a second height that is less than the first height.
 14. The method of claim 1 wherein moving the end effector a first distance into a processing chamber of the substrate processing system includes transporting the substrate into the processing chamber while the substrate is supported on the second, fifth, and sixth substrate support pads, and the method further comprises: transporting the substrate out of the processing chamber while the substrate is supported on the first, third, fourth, and seventh support pads.
 15. The method of claim 1 wherein moving the end effector a first distance into a processing chamber of the substrate processing system includes moving the end effector a first distance into a processing chamber of the substrate processing system while the peripheral edge of the substrate is engaged with the second, fifth, and sixth substrate support pads.
 16. The method of claim 1 wherein: the substrate does not contact any of the first, third, fourth, and seventh support pads while the peripheral edge of the substrate is engaged with the second, fifth, and sixth support pads; and the substrate does not contact any of the second, fifth, and sixth support pads while the peripheral edge of the substrate is engaged with the first, third, fourth, and seventh support pads. 